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LED SPECIFICATION 520PR2C
Features
Single color High bright output Low power consumption High reliability and long life
Descriptions
Dice materialAlGaInP Hewlett Packard Emitting Color Super Bright RED Device Outline 5mm Round Type/ 5mm Lens Type Water Clear
1. All dimensions are millimeters 2. Tolerance is +/-0.25mm unless otherwise noted
Directivity
1.0 0 Ta=25 C IF=20mA 30
Relative Luminous
0.5
60
0
90
60
30
0
0.5
90 1.0
Radiation Angle
Page: 1
LED SPECIFICATION
Absolute maximum ratingsTa = 25
Parameter Reverse Voltage Forward Current Power Dissipation Pulse Current Operating Temperature Storage Temperature Symbol VR IF Pd Ipeak Topr Tstr Test Condition Value Min. 5 ----------40 -40 Max. -30 75 100 +85 +100 Unit V mA mW mA
IR = 30A ------Duty=0.1mS1kHz -------
Electrical and optical characteristics Ta = 25
Parameter Forward Voltage Reverse Current Dominate Wavelength Spectral Line half-width Luminous Intensity Viewing Angle Symbol VF IR d IV 21/2 Test Condition IF = 20mA VR = 5V IF = 20mA IF = 20mA IF = 20mA IF = 20mA 17 ------Value Min. Typ. V3~V5 ---R1~R3 20 W,X 23 Deg. ---nm 30 A Max. Unit
Page: 2
BIN ranking for LEDs
BRIGHTNESS BIN
Bin Code A B C D E F G IV(mcd) 0-5.0 5.0-7.0 7.0-9.8 9.8-13.7 13.7-19.0 19.0-26.6 26.6-37.2 Bin Code H J K L M N P IV(mcd) Bin Code 37.2-52.0 52.0-72.8 72.8-102 102-145 145-200 200-280 280-390 Q R S T U V W IV(mcd) 390-550 550-770 770-1100 1100-1520 1520-2130 2130-3000 3000-4180 Bin Code X Y Z1 Z2 Z3 Z4 Z5 IV(mcd) 4180--5860 5860-8200 8-10cd 10-12cd 12-14cd 14-16cd 16-18cd
WAVELENGTH BIN
Ligth Col. Bin Code Wavel. (nm) Ligth Col. Bin Code Wavel. (nm) B1 BLUE B2 B3 B4 B5 B6 G1 G2 BLUE GREEN G3 G4 G5 G6 G7 G8 G9 G10 G11 G12 PURE GREEN G13 G14 G15 G16 G17 G18 G19 450-455 455-460 460-465 465-470 470-475 475-480 491-494 494-497 497-500 500-503 503-506 506-509 509-512 512-515 515-518 518-521 521-524 524-527 527-530 530-533 533-536 536-539 539-542 542-545 545-548 RED PURE ORANGE YELLOW ORANGE YELLOW YG1 YG2 YG3 YG4 YG5 YG6 YG7 Y1 Y2 Y3 Y4 Y5 YO1 YO2 YO3 YO4 O1 O2 O3 R1 R2 R3 R4 R5 R6 555-558 558-561 561-564 564-567 567-570 570-573 573-576 582-585 585-588 588-591 591-594 594-597 597-600 600-603 603-606 606-609 609-612 612-615 615-618 618-621 621-624 624-627 627-630 630-633 633-636
YELLOW GREEN
FORWARD VOLTAGE (VF) BIN
Bin Code V1 V2 V3 V4 VF (V) 1.6-1.8 1.8-2.0 2.0-2.2 2.2-2.4 Bin Code V5 V6 V7 V8 VF (V) 2.4-2.6 2.6-2.8 2.8-3.0 3.0-3.2 Bin Code V9 V10 V11 V12 VF (V) 3.2-3.4 3.4-3.6 3.6-3.8 3.8-4.0 Bin Code V13 V14 V15 V16 VF (V) 4.0-4.2 4.2-4.4 4.4-4.6 4.6-4.8
Page: 3
LED SPECIFICATION
Typical electrical/optical characteristic curves
FORWARD CURRENT Vs. FORWARD VOLTAGE
50 Forward Current(mA) 40 30 20 10 0 1.5 1.7 1.9 2.1 2.3 Forward Voltage(V) 2.5 Luminous Intensity Relative Value at IF=20mA 2.5 2.0 1.5 1.0 0.5 0 0 10 20 30 40 IF-Forward Current (mA) 50
LUMINOUS INTENSITY Vs. FORWARD CURRENT
FORWARD CURRENT Vs. AMBIENT TEMPERATURE
Relative Luminous Intensity 50 Forward Current(mA) 40 30 20 10 0 0 20 40 60 80 100 2.5 2.0 1.5 1.0 0.5 0 -40
LUMINOUS INTENSITY Vs. AMBIENT TEMPERATURE
Ambient Temperature TA ( )
-20 40 60 0 20 Ambient Temperature TA ( )
80 90
Relative Luminous Intensity
100 75 50 25 0 450 500 550 650 600 Wavelength (nm) 700 750
Page: 4
LED
SOLDERING
METHOD
LAMP APPLICATION
SOLDERING CONDITIONS
REMARK Solder no closer than 3mm from the base of the package Using soldering flux," RESIN FLUX" is recommended.
DIP SOLDERING
Bath temperature: 2605 Immersion time: with 5 sec
During soldering, take care not to press the tip of iron against the Soldering iron: 30W or smaller lead. SOLDERING Temperature at tip of iron: 260 or lower (To prevent heat from being IRON Soldering time: within 5 sec. transferred directly to the lead, hold the lead with a pair of tweezers while soldering 1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1), be careful not to stress the leads with iron tip.
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
Lead wries
Leave
a slight clearance
(Fig.2)
Page : 5
LED
LAMP APPLICATION
3) Similarly, when a jig is used to solder the LED to PC board, take care as much as possible to avoid steering the leads (See Fig.3).
PC board
F ig.3 jig
4) Repositioning after soldering should be avoided as much as possible. If inevitable, be sure to preserve the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature.
LED MOUNTING METHOD
1) When mounting the LED by using a case, as shown Fig.4, ensure that the mounting holds on the PC board match the pitch of the leads correctly-tolerance of dimensions of the respective components including the LED should be taken into account especially when designing the case, PC board, etc. to prevent pitch misalignment between the leads and board holes, the diameter of the board holes should be slightly larger than the size of the lead. Alternatively, the shape of the holes should be made oval. (See Fig.4)
case
pc board
Fig.4
Page : 6
LED
LAMP APPLICATION
2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of resin (Fig.6) to position the LEDs.
Tube
Stand-off
Fig.5
Fig.6
FORMED LEAD
1) The lead should be bent at a point located at least 2mm away from the package. Bending should be performed with base fixed means of a jig or pliers (Fig.7)
Fig.7
2) Forming lead should be carried our prior to soldering and never during or after soldering. 3) Form the lead to ensure alignment between the leads and the hole on board, so that stress against the LED is prevented. (Fig.8)
2mm
Page : 7
LED
LEAD STRENGTH
LAMP APPLICATION
1) Bend strength Do not bend the lead more than twice. (Fig.9)
Fig.9
2) Tensile strength (@Room Temperature) If the force is 1kg or less, there will be no problem. (Fig.10)
OK
1Kg
Fig.10
HANDLING PRECAUTIONS
Although rigid against vibration, the LEDs may damaged or scratched if dropped. So take care when handling.
CHEMICAL RESISTANCE
1) Avoid exposure to chemicals as it may attack the LED surface and cause discoloration. 2) When washing is required, refer to the following table for the proper chemical to be sued. (Immersion time: within 3 minutes at room temperature.) SOLVENT Freon TE Chlorothene Isopropyl Alcohol Thinner Acetone Trichloroethylene --Usable ADAPTABILITY NOTE: Influences of ultrasonic cleaning of the LED resin body differ depending on such factors as the oscillator output, size of the PC board and the way in which the LED is mounted. Therefore, ultrasonic cleaning should only be performed after confirming there is no problem by conducting a test under practical.
--Do not use.
Page : 8
LED
LAMP PASSED TESTS
Experiment Item:
Item Test Condition
Lamp & IR Ta 255 IF= 20mA RH=60%RH DYNAMIC:100mA 1ms 1/10 duty STATIC STATE: IF20mA TEST TIME: 168HRS-24HRS+24HRS 500HRS-24HRS+24HRS 1000HRS-24HRS+72HRS Ta 655 RH 9095%RH TEST TIME240HRS2HRS 10525-5525 30min 5min 30min 5min 10CYCLES 1055-555 10min 10min 10CYCLES Reference Standard
OPERATION LIFE
MIL-STD-7501026 MIL-STD-8831005 JIS C 7021B-1
HIGH TEMPERATURE HIGH HUMIDITY STORAGE TEMPERATURE CYCLING
MIL-STD-202103B JIS C 7021 B-1
MIL-STD-202107D MIL-STD-7501051 MIL-STD-8831010 JIS C 7021 A-4 MIL-STD-202107D MIL-STD-7501051 MIL-SYD-8831011 MIL-STD-202210A MIL-STD-750-2031 JIS C 7021A-1 MIL-STD-202208D MIL-STD-7502026 MIL-STD-8832003 JIS C 7021 A-2
THERMAL SHOCK
SOLDER RESISTANCE
Tsol2605 DWELL TIME10lsec Tsol2305 DWELL TIME5lsec Circuit model B
SOLDERABILITY
Drive Method Circuit model A
Page : 9 (A)Recommended circuit. (B)The difference of brightness between LEDs could be found due to the Vf-If characteristics of LED.

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